Medium Temperature Lead-free Solder Paste Welding. Tin Sn64Bi35Ag1 Environmentally Friendly Solder

No-clean lead-free solder paste, high-reliability flux with good wettability and good solderability, and lead-free alloy powder of high sphericity and low oxygen content of Sn64Ag1Bi35, scientifically prepared. It can meet the needs of lead-free medium temperature solder joints. It is an ideal environmentally friendly no-clean lead-free solder paste for use with lead-free soldering processes.

◆The flux system is scientifically selected. It is specially developed for lead-free solder (SnAgBi system) according to the soldering mechanism. It can effectively reduce the free energy of lead-free solder and reduce the surface tension, and improve the fluidity and solderability of molten lead-free solder.

   ◆Excellent continuous printing, good off-line molding, strong adhesion, and not easy to collapse.

   ◆The reflow process window is wide, and excellent soldering effect can be achieved in a wide reflow soldering temperature zone.

   ◆Excellent weldability, full tin on the solder joints, bright, strong tin-transparent, low soldering failure rate.

   ◆Residual residue after welding, no cleaning, excellent ICT test performance, high surface insulation resistance and reliable electrical performance.

   ◆It does not contain environmentally-banned substances such as RoHS, and is an environmentally-friendly, no-clean, lead-free solder paste.